Electronic ic nti Txhawb BOM Kev Pabcuam TPS54560BDDAR brand tshiab ic chips electronics Cheebtsam

1.IC naming, pob kev paub dav dav thiab naming cov cai:

Qhov kub thiab txias.

C = 0 ° C txog 60 ° C (qib lag luam);I = -20 ° C txog 85 ° C (qib kev lag luam);E = -40 ° C txog 85 ° C (ntxiv qib kev lag luam);A = -40 ° C txog 82 ° C (qib aerospace);M = -55 ° C txog 125 ° C (qib tub rog)

Hom pob.

A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic tooj liab sab saum toj;E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-Narrow DIP;N-DIP;Q PLCC;R - Nqaim Ceramic DIP (300mil);S - TO-52, T - TO5, TO-99, TO-100;U - TSSOP, uMAX, SOT;W - Daim ntawv me me dav dav (300mil) W-Wide daim ntawv me me (300 mil);X-SC-60 (3P, 5P, 6P);Y-Nqaim tooj liab saum;Z-TO-92, MQUAD;D-Tuag;/PR-Reinforced yas;/W-Wafer.

Number ntawm pins:

a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;ib-4;H-4;Ib-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (nruab nrab);W-10 (nruab nrab);X-36;Y-8 (nruab nrab);Z-10 (zeeg).(round).

Faj seeb: Thawj tsab ntawv ntawm plaub tsab ntawv suffix ntawm chav kawm interface yog E, uas txhais tau hais tias lub cuab yeej muaj antistatic muaj nuj nqi.

2.Kev loj hlob ntawm kev ntim tshuab

Cov kev sib xyaw ua ke ntxov tshaj plaws siv cov pob zeb ceramic tiaj tus, uas txuas ntxiv siv los ntawm cov tub rog tau ntau xyoo vim tias lawv muaj kev ntseeg siab thiab me me.Kev lag luam ntim khoom lag luam sai sai hloov mus rau ob lub pob hauv-kab, pib nrog cov ceramic thiab tom qab ntawd yas, thiab hauv xyoo 1980s tus pin suav ntawm VLSI circuits tau dhau ntawm daim ntawv thov txwv ntawm DIP pob, nws thiaj li ua rau muaj qhov tshwm sim ntawm tus pin grid arrays thiab chip carriers.

Lub pob mount nto tau tshwm sim thaum xyoo 1980s thiab tau nrov nyob rau tom qab ntawm kaum xyoo ntawd.Nws siv tus pin suab zoo dua thiab muaj tus gull-tis lossis J-puab tus pin zoo.Piv txwv li Small-Outline Integrated Circuit (SOIC), muaj 30-50% tsawg dua cheeb tsam thiab yog 70% tsawg dua qhov sib npaug DIP.Cov pob no muaj gull-tis-puab pins protruding los ntawm ob sab ntev thiab tus pin suab ntawm 0.05 ".

Small-Outline Integrated Circuit (SOIC) thiab PLCC pob.nyob rau xyoo 1990, txawm hais tias PGA pob tseem feem ntau siv rau high-end microprocessors.PQFP thiab nyias pob me me-cov txheej txheem (TSOP) tau dhau los ua cov pob ib txwm muaj rau cov khoom siv pin siab.Intel thiab AMD's high-end microprocessors tau txav los ntawm PGA (Pine Grid Array) pob khoom rau Land Grid Array (LGA) pob.

Pob Grid Array pob pib tshwm nyob rau hauv 1970s, thiab nyob rau hauv 1990s FCBGA pob tau tsim nrog tus pin ntau dua li lwm cov pob.Nyob rau hauv lub pob FCBGA, qhov tuag yog flipped thiab down thiab txuas nrog cov pob solder ntawm lub pob los ntawm PCB-zoo li lub hauv paus txheej es tsis yog cov xov hlau.Nyob rau hauv kev ua lag luam niaj hnub no, lub ntim kuj yog tam sim no ib feem ntawm cov txheej txheem, thiab cov cuab yeej technology ntawm lub pob kuj tuaj yeem cuam tshuam qhov zoo thiab cov txiaj ntsig ntawm cov khoom.