Taw qhia rau cov txheej txheem wafer Back Grinding
1. Lub hom phiaj ntawm Back Grinding
Nyob rau hauv tus txheej txheem ntawm kev ua semiconductors los ntawm wafers, cov tsos ntawm wafers hloov tas li.Ua ntej, nyob rau hauv cov txheej txheem tsim wafer, Ntug thiab saum npoo ntawm wafer yog polished, ib txheej txheem uas feem ntau grinds ob sab ntawm lub wafer.Tom qab qhov kawg ntawm cov txheej txheem pem hauv ntej-kawg, koj tuaj yeem pib cov txheej txheem rov qab sib tsoo uas tsuas yog grinds sab nraum qab ntawm lub wafer, uas tuaj yeem tshem tawm cov tshuaj lom neeg hauv cov txheej txheem pem hauv ntej-kawg thiab txo cov thickness ntawm cov nti, uas yog qhov tsim nyog heev. rau zus tau tej cov nyias nyias mounted rau IC phaib los yog mobile pab kiag li lawm.Tsis tas li ntawd, cov txheej txheem no muaj qhov zoo ntawm kev txo qhov tsis kam, txo kev siv hluav taws xob, nce thermal conductivity thiab sai sai dissipating cua sov rau sab nraum qab ntawm wafer.Tab sis nyob rau tib lub sij hawm, vim hais tias lub wafer yog nyias, nws yog ib qho yooj yim mus tawg los yog warped los ntawm sab nraud rog, ua rau cov txheej txheem ntau nyuaj.
2. Back Grinding (Back Grinding) cov txheej txheem ntxaws
Kev sib tsoo rov qab tuaj yeem muab faib ua peb kauj ruam hauv qab no: ua ntej, muab tshuaj tiv thaiv kab xev Lamination rau ntawm wafer;Thib ob, zom rov qab ntawm wafer;Thib peb, ua ntej cais cov nti ntawm Wafer, lub wafer yuav tsum tau muab tso rau ntawm Wafer Mounting uas tiv thaiv daim kab xev.Cov txheej txheem wafer thaj yog cov txheej txheem npaj rau kev cais covnti(txiav cov nti) thiab yog li ntawd kuj tuaj yeem suav nrog hauv cov txheej txheem txiav.Nyob rau hauv xyoo tas los no, raws li cov chips tau dhau los ua nyias, cov txheej txheem ua ntu zus kuj yuav hloov, thiab cov txheej txheem cov txheej txheem tau ua kom zoo dua qub.
3. Daim kab xev Lamination txheej txheem rau kev tiv thaiv wafer
Thawj kauj ruam hauv kev sib tsoo rov qab yog txheej txheej.Qhov no yog txheej txheem txheej uas sticks daim kab xev rau pem hauv ntej ntawm lub wafer.Thaum sib tsoo ntawm sab nraub qaum, cov khoom siv silicon yuav kis mus rau ib puag ncig, thiab cov wafer kuj tseem tuaj yeem tawg lossis tawg vim yog sab nraud quab yuam thaum lub sijhawm txheej txheem no, thiab qhov loj dua ntawm thaj chaw wafer, qhov cuam tshuam rau qhov tshwm sim no.Yog li ntawd, ua ntej sib tsoo lub nraub qaum, nyias nyias Ultra Violet (UV) zaj duab xis xiav yog txuas los tiv thaiv lub wafer.
Thaum thov cov yeeb yaj kiab, txhawm rau ua kom tsis muaj qhov sib txawv lossis cov npuas huab cua ntawm wafer thiab daim kab xev, nws yog ib qho tsim nyog yuav tsum tau ua kom cov nplaum nplaum.Txawm li cas los xij, tom qab sib tsoo sab nraub qaum, daim kab xev ntawm lub wafer yuav tsum tau irradiated los ntawm ultraviolet lub teeb kom txo tau cov nplaum nplaum.Tom qab stripping, daim kab xev residue yuav tsum tsis txhob nyob twj ywm ntawm wafer nto.Qee zaum, cov txheej txheem yuav siv cov adhesion tsis muaj zog thiab nquag ua npuas uas tsis yog ultraviolet txo cov membrane kho, txawm tias muaj ntau yam tsis zoo, tab sis pheej yig.Tsis tas li ntawd, Bump films, uas yog ob zaug tuab li UV txo daim nyias nyias, kuj tseem siv tau, thiab yuav tsum tau siv nrog ntau zaus yav tom ntej.
4. Lub wafer thickness yog inversely proportional rau lub nti pob
Wafer thickness tom qab sib tsoo backside feem ntau txo los ntawm 800-700 µm rau 80-70 µm.Cov wafers thinned mus rau ib feem kaum tuaj yeem ua rau plaub mus rau rau txheej.Tsis ntev los no, wafers tuaj yeem ua rau nyias mus txog li 20 millimeters los ntawm ob txoj kev sib tsoo, yog li stacking lawv mus rau 16 mus rau 32 txheej, ntau txheej semiconductor qauv hu ua ntau lub pob (MCP).Hauv qhov no, txawm tias siv ntau txheej txheej, tag nrho qhov siab ntawm cov pob tiav yuav tsum tsis pub tshaj ib lub thickness, uas yog vim li cas thinner sib tsoo wafers yeej ib txwm caum.Qhov thinner lub wafer, ntau qhov tsis xws luag muaj, thiab qhov nyuaj dua cov txheej txheem tom ntej yog.Yog li ntawd, kev siv tshuab siab heev yog xav tau los txhim kho qhov teeb meem no.
5. Hloov txoj kev sib tsoo rov qab
Los ntawm kev txiav wafers nyias li ua tau kom kov yeej cov kev txwv ntawm kev ua cov txheej txheem, backside sib tsoo tshuab txuas ntxiv mus.Rau cov wafers uas muaj thickness ntawm 50 los yog ntau dua, backside Sib tsoo muaj peb kauj ruam: ib tug ntxhib sib tsoo thiab ces ib tug zoo sib tsoo, qhov twg lub wafer txiav thiab polished tom qab ob zaug sib tsoo.Nyob rau ntawm lub sijhawm no, zoo ib yam li Chemical Mechanical Polishing (CMP), Slurry thiab Deionized Dej feem ntau yog siv ntawm polishing ncoo thiab wafer.Qhov kev ua haujlwm polishing no tuaj yeem txo qhov kev sib txhuam ntawm wafer thiab polishing ncoo, thiab ua kom lub ntsej muag ci.Thaum lub wafer tuab dua, Super Fine Sib Tsoo tuaj yeem siv tau, tab sis qhov thinner lub wafer, yuav tsum tau polishing ntau dua.
Yog hais tias lub wafer ua thinner, nws yog nquag mus rau sab nraud tsis xws luag thaum lub sij hawm txiav.Yog li ntawd, yog hais tias lub thickness ntawm lub wafer yog 50 µm los yog tsawg dua, cov txheej txheem ua ntu zus tuaj yeem hloov pauv.Lub sijhawm no, DBG (Dicing Ua Ntej Sib Tsoo) txoj kev siv, uas yog, wafer txiav hauv ib nrab ua ntej thawj zaug sib tsoo.Lub nti yog ruaj ntseg cais los ntawm lub wafer nyob rau hauv kev txiav txim ntawm Dicing, sib tsoo, thiab slicing.Tsis tas li ntawd, muaj cov kev sib tsoo tshwj xeeb uas siv lub khob iav muaj zog los tiv thaiv lub wafer los ntawm kev tawg.
Nrog rau qhov kev thov nce ntxiv rau kev koom ua ke hauv cov khoom siv hluav taws xob miniaturization, backside sib tsoo tshuab yuav tsum tsis tsuas yog kov yeej nws cov kev txwv, tab sis kuj tseem txhim kho.Nyob rau tib lub sijhawm, nws tsis yog tsuas yog tsim nyog los daws qhov teeb meem tsis xws luag ntawm wafer, tab sis kuj tseem npaj rau cov teeb meem tshiab uas yuav tshwm sim hauv cov txheej txheem yav tom ntej.Yuav kom daws tau cov teeb meem no, tej zaum yuav tsim nyoghloovcov txheej txheem sib lawv liag, los yog qhia tshuaj etching tshuab siv rau lubsemiconductorcov txheej txheem pem hauv ntej, thiab tag nrho tsim cov txheej txheem tshiab.Yuav kom daws tau qhov tsis xws luag ntawm thaj chaw loj wafers, ntau txoj kev sib tsoo raug tshawb nrhiav.Tsis tas li ntawd, kev tshawb fawb tau tshawb fawb txog yuav ua li cas rov ua dua silicon slag ua tom qab sib tsoo cov wafers.
Post lub sij hawm: Lub Xya hli ntuj-14-2023