Thawj IC XCKU025-1FFVA1156I Chip Integrated Circuit IC FPGA 312 I/O 1156FCBGA

luv luv piav qhia:

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA, FCBGA

Product Detail

Khoom cim npe

Yam khoom

HOM	PAUB
qeb	Integrated Circuits (ICs) Embedded Field Programmable Gate Arrays (FPGAs)
neeg tsim khoom	AMD
series	Kintex® UltraScale™
qhwv	loj
Khoom xwm txheej	Active
DigiKey yog programmable	Tsis tau txheeb xyuas
LAB/CLB num	18180 ib
Number of logic element/units	3 18150
Tag nrho cov naj npawb ntawm RAM khoom	13004800 Nws
Number of I/Os	312
Voltage - Cov khoom siv hluav taws xob	0.922V ~ 0.979V
Hom kev teeb tsa	Nto nplaum hom
Ua haujlwm kub	-40 ° C ~ 100 ° C (TJ)
Pob / Tsev	1156- PAB,FCBGA
Vendor tivthaiv encapsulation	1156-FCBGA (35x35)
Cov khoom lag luam tus lej	TXK 025

Cov ntaub ntawv & Media

TSEEM CEEB	LINK
Cov ntaub ntawv	Kintex® UltraScale™ FPGA Cov Ntaub Ntawv
Cov ntaub ntawv ib puag ncig	Xiliinx RoHS Cert Xilinx REACH211 Cert
PCN tsim / specification	Ultrascale & Virtex Dev Spec Chg 20/Dec/2016

Classification ntawm ib puag ncig thiab export specifications

TXOJ CAI	PAUB
RoHS xwm txheej	Ua raws li ROHS3 cov lus qhia
Humidity Sensitivity Level (MSL)	4 (72 teev)
REACH xwm txheej	Tsis raug raws li REACH specification
ECCN	3a991 ua
HTSUS	8542.39.0001

Khoom Taw Qhia

FCBGA(Flip Chip Ball Grid Array) sawv cev rau "flip chip ball grid Array".

FC-BGA (Flip Chip Ball Grid Array), uas yog hu ua flip chip pob grid array pob hom, kuj tseem yog hom pob tseem ceeb tshaj plaws rau cov duab nrawm nrawm tam sim no.Lub tshuab ntim tshuab no tau pib hauv xyoo 1960, thaum IBM tsim lub npe hu ua C4 (Controlled Collapse Chip Connection) thev naus laus zis rau kev sib dhos ntawm cov khoos phis tawj loj, thiab tom qab ntawd tau tsim kho ntxiv los siv qhov nro ntawm cov pob zeb molten los txhawb qhov hnyav ntawm cov nti. thiab tswj qhov siab ntawm lub pob.Thiab dhau los ua txoj kev loj hlob ntawm flip technology.

Dab tsi yog qhov zoo ntawm FC-BGA?

Ua ntej, nws dawselectromagnetic compatibility(EMC) thiabelectromagnetic cuam tshuam (EMI)teeb meem.Feem ntau hais lus, lub teeb liab kis tau tus mob ntawm cov nti siv WireBond ntim tshuab yog nqa tawm los ntawm cov hlau hlau nrog ib qho ntev.Nyob rau hauv cov ntaub ntawv ntawm high zaus, txoj kev no yuav ua rau lub thiaj li hu ua impedance nyhuv, tsim ib tug obstacles ntawm lub teeb liab txoj kev.Txawm li cas los xij, FC-BGA siv pellets es tsis txhob pins los txuas cov processor.Cov pob no siv tag nrho ntawm 479 pob, tab sis txhua tus muaj txoj kab uas hla ntawm 0.78 hli, uas muab qhov luv tshaj plaws sab nraud txuas.Siv cov pob no tsis tsuas yog muab hluav taws xob ua tau zoo, tab sis kuj txo qhov poob thiab inductance ntawm cov khoom sib txuas, txo cov teeb meem ntawm electromagnetic cuam tshuam, thiab tuaj yeem tiv taus ntau zaus, rhuav tshem cov kev txwv overclocking ua tau.

Thib ob, raws li cov neeg tsim qauv tso tawm ntau dua thiab ntau dua ntawm FC-BGA yog tias nws tuaj yeem nce cov ntom ntom ntawm i / o .Feem ntau hais lus, I / O coj siv WireBond thev naus laus zis tau teeb tsa nyob ib puag ncig ntawm lub nti, tab sis tom qab FC-BGA pob, I / O coj tuaj yeem npaj rau hauv ib qho array ntawm lub nti, muab qhov ceev dua I / O. layout, ua rau qhov zoo tshaj plaws kev siv efficiency, thiab vim hais tias ntawm no zoo.Inversion thev naus laus zis txo qhov chaw los ntawm 30% mus rau 60% piv rau cov ntawv ntim khoom ib txwm muaj.

Thaum kawg, nyob rau hauv lub cim tshiab ntawm high-ceev, siab integrated zaub chips, qhov teeb meem ntawm tshav kub dissipation yuav yog ib qho kev sib tw loj.Raws li qhov tshwj xeeb flip pob daim ntawv ntawm FC-BGA, sab nraub qaum ntawm lub nti tuaj yeem raug rau huab cua thiab tuaj yeem cuam tshuam ncaj qha tshav kub.Nyob rau tib lub sijhawm, lub substrate tseem tuaj yeem txhim kho cov cua sov ua kom zoo dua los ntawm txheej txheej hlau, los yog nruab ib lub tshuab hluav taws xob hlau rau sab nraum qab ntawm cov nti, ntxiv dag zog rau cov cua kub dissipation peev xwm ntawm cov nti, thiab txhim kho kev ruaj ntseg ntawm cov nti. ntawm kev ua haujlwm siab.

Vim qhov zoo ntawm FC-BGA pob, yuav luag tag nrho cov duab acceleration card chips tau ntim nrog FC-BGA.

Yav dhau los: XC7VX485T-2FFG1761I Virtex®-7 T thiab XT FPGAs muaj nyob rau hauv qib -3, -2, -1, thiab -2L ceev RoHS raws

Tom ntej: XCVU9P-2FLGB2104I FPGA, VIRTEX ULTRASCALE,FCBGA-2104

Sau koj cov lus ntawm no thiab xa tuaj rau peb