XCVU9P-2FLGB2104I FPGA, VIRTEX ULTRASCALE,FCBGA-2104
Cov ntaub ntawv khoom
| TYPENo.Ntawm Logic Blocks: | 25 86150 |
| No. ntawm Macrocells: | 25 86150 Macrocells |
| FPGA Tsev Neeg: | Virtex UltraScale Series |
| Logic Case Style: | FCBGA |
| No. Pins: | 2 104 Pin |
| No. ntawm Qib Qib: | 2 |
| Tag nrho RAM khoom: | 7 7722kb |
| No. ntawm I/O's: | 778 Ib |
| Tswj moos: | MCM, PLL |
| Core Supply Voltage Min: | 922m wb |
| Core Supply Voltage Max: | 979m wb |
| I / O Cov Khoom Siv Hluav Taws Xob: | 3.3v ua |
| Ua haujlwm zaus Max: | 725 MHz |
| Yam khoom: | Virtex UltraScale XCVU9P |
| MSL: | - |
Khoom Taw Qhia
BGA sawv rauPob Grid Q Array Pob.
Lub cim xeeb encapsulated los ntawm BGA thev naus laus zis tuaj yeem ua kom lub cim xeeb muaj peev xwm nce mus txog peb zaug yam tsis tau hloov lub ntim ntawm lub cim xeeb, BGA thiab TSOP
Piv nrog rau, nws muaj qhov ntim me me, kev ua kom sov zoo dua thiab kev ua haujlwm hluav taws xob.BGA ntim tshuab tau zoo heev txhim kho lub peev xwm cia ib square inch, siv BGA ntim tshuab nco cov khoom nyob rau hauv tib lub peev xwm, lub ntim tsuas yog ib feem peb ntawm TSOP ntim;Ntxiv rau, nrog kev lig kev cai
Piv nrog rau TSOP pob, BGA pob muaj kev ua kom sov sai dua thiab zoo dua.
Nrog rau txoj kev loj hlob ntawm integrated circuit technology, lub ntim yuav tsum tau ntawm integrated circuits yog nruj dua.Qhov no yog vim hais tias lub tshuab ntim khoom muaj feem xyuam rau kev ua haujlwm ntawm cov khoom, thaum lub zaus ntawm IC tshaj 100MHz, txoj kev ntim khoom ib txwm tuaj yeem tsim qhov "Cross Talk• phenomenon, thiab thaum tus naj npawb ntawm cov pins ntawm IC yog. ntau dua 208 Pin, txoj kev ntim khoom ib txwm muaj nws cov teeb meem. Yog li ntawd, ntxiv rau kev siv QFP ntim, feem ntau niaj hnub no tus pin suav chips (xws li cov duab chips thiab chipsets, thiab lwm yam) tau hloov mus rau BGA (Ball Grid Array. PackageQ) ntim tshuab thaum BGA tshwm sim, nws tau los ua qhov kev xaiv zoo tshaj plaws rau cov khoom siv high-density, high-performance, multi-pin tej pob khoom xws li cpus thiab sab qab teb / North choj chips ntawm motherboards.
BGA ntim tshuab tuaj yeem muab faib ua tsib pawg:
1.PBGA (Plasric BGA) substrate: Feem ntau 2-4 khaubncaws sab nraud povtseg ntawm cov khoom siv organic muaj li ntawm ntau txheej pawg thawj coj saib.Intel series CPU, Pentium 1l
Chuan IV processors yog tag nrho cov ntim rau hauv daim ntawv no.
2.CBGA (CeramicBCA) substrate: uas yog, ceramic substrate, cov hluav taws xob kev twb kev txuas ntawm lub nti thiab lub substrate feem ntau yog flip-chip
Yuav ua li cas rau nruab FlipChip (FC luv luv).Intel series cpus, Pentium l, ll Pentium Pro processors yog siv
Ib daim ntawv ntawm encapsulation.
3.FCBGA(FilpChipBGA) substrate: Hard multi-layer substrate.
4.TBGA (TapeBGA) substrate: Lub substrate yog ib tug ribbon mos 1-2 txheej PCB Circuit Court board.
5.CDPBGA (Carty Down PBGA) substrate: yog hais txog qhov tsawg square nti cheeb tsam (tseem hu ua kab noj hniav cheeb tsam) nyob rau hauv nruab nrab ntawm lub pob.
BGA pob muaj cov yam ntxwv hauv qab no:
1) 1.10 Tus naj npawb ntawm cov pins tau nce, tab sis qhov kev ncua deb ntawm cov pins yog ntau dua li ntawm QFP ntim, uas txhim kho cov txiaj ntsig.
2).Txawm hais tias lub zog noj ntawm BGA yog nce, qhov hluav taws xob cua sov kev ua tau zoo tuaj yeem txhim kho vim kev tswj kev sib tsoo chip vuam txoj kev.
3).Lub teeb liab kis tau tus mob qeeb me me, thiab qhov kev hloov pauv hloov tau zoo heev.
4).Kev sib dhos tuaj yeem yog coplanar welding, uas txhim kho kev ntseeg tau zoo.
